Thermal Pad TS100-深圳天中山实业有限公司_

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Thermal Pad TS100

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Departure Port : Shenzhen

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Product Specifications

Brand name：China Tensan

Product Description

Features & Benefits

l REACH, ROHS certified

l 1.0 thermal conductivity

l Good temperature resistance

l Silicone based

Application

l Lighting assemblies

l Telecom equipment

l Consumer electronics

l Power supplies

l Power components for transportation

l Computer CPU

Description

Thermal pad also called thermally conductive pad or thermal interface pad, it is used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact.

It sits between two components and transfer heat from one to the other. This usually means dissipating heat from a heat source to a heat sink, to protect a device from overheating.

It is much cleaner and easier to install with good heat dissipation performance.

Packing Information

Pack with good quality carton.

Actual packing condition will depend on the actual dimension and quantity.

Storage and Validity

Stored at room temperature, and in a cool, ventilated, dry place.

Shelf life: 12 months

Typical Properties

Property	Result	Testing
Color	Grey	Visual inspection
Thickness	0.5—10mm	ASTMD374
Matrix	Silicone Rubber	_
Filler	aluminum oxide etc.	_
Breakdown Voltage(KV)	4	ASTMD149
Dielectric Constant	6.5	ASTMD150
Volume Resistivity (?*m)	10*12	ASTMD257
Flammability Class(UL)	Vo	UL
Thermal Conductivity (W/m.k)	1.0	ASTMD5470
Thermal Impedance (c.in/w)	0.8	ASTMD5470
Operation Temperature	-60-200	TGA+DMA
TO247Thermal Resistance (°C /w)	0.90	ASTMD5470
Elongation (%)	10	10
Tensile Strength	0.2Mpa	0.2
Hardness	50	ASTMD2240
Compression ratio	50%	ASTMD412