Thermal Conductive Pad for CPU

Our company (Tensan) produces high-adhesion thermal conductive silicone pad, which mainly used in low fastening pressure applications. Low modulus polymers attached to fiberglass substrates, Between the machine's contact surfaces it can be used as a fill interface. High adhesion and low hardness, enhanced voltage breakdown, good electrical insulation, to meet the ROHS and UL environmental requirements. It is with high thermal conductivity, and made of fiberglass cloth thermal silicone pad, mainly used for heating devices and heat sink or heat conduction for product shells without fastening device.

Typical applications for Thermal pad TS300

◆ LED lighting, lighting equipment

◆ Household appliances, LCD monitors

◆ Between the semiconductor and the heat sink

◆ Communications products, smart phones, tablet PCs

◆ Desktop computers, notebooks and other portable computers

◆ High power Electrical appliances power supply

Features and advantages of Thermal pad TS300

High thermal conductivity, low thermal resistance;

Excellent insulation performance;

Good surface wetting;

Good resilience, reliable long-term duration

Elements of Thermal pad TS300

Ceramic thermal powder; Silicone elastomers

Product description ofThermal pad TS300

1.The product has high thermal conductivity, under the relative pressure  can achieve low interface thermal resistance. Application of power devices and cooling aluminum or machine shell, you can effectively remove the air, to achieve a good filling effect.

2.Products with good insulation pressure and temperature stability, safe and reliable.

3.The product has good softness and resilience. 

Production Environment of Thermal pad TS300

Our company is committed to becoming a leading thermal management and electromagnetic shielding material solution company that can challenge the international giants through independent research and development materials and its application technology. The control of harmful substances is in line with the EU ROHS / ROHS control standards.

Packing specifications of Thermal pad TS300

Size: length 400mm*200mm  (0.5≤T≤5.0mm), according to customers’ requirements

Health and safety

Shelf life:18 months;

Storage conditions: Cool and dry place (5℃<T<30℃); Relative humidity: RH<70%

Others

For more product information, please visit our website.www.sztensan.com/mark@sztensan.com  

Tel.:+86-755-23778007